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Here you can find the 2020 GATE Material Science (XE-C) paper with answer key and full explanation in pdf given below:
This set of Engineering Materials Science "Problems & Answers" are based on “GATE 2020 (XE-C)”
GATE 2020 (XE-C)
QUESTIONS, ANSWERS & EXPLANATION
UNIT - I (QUESTION 1 to 9)
1) A Pb-Sn sample of eutectic composition, containing α- and β- phases, is examined in a scanning electron microscope. The α-phase contains ~97 wt.% Pb (atomic number 82) while β-phase contains ~99 wt.% Sn (atomic number 50). The ratio of number of backscattered electrons escaping from α-phase to that from β-phase would be:
Correct Answer is "C"
For scanning electron microscope,
The number of backscattered electrons (BSE) ∝ mean atomic number
(BSE)α/(BSE)β = (Mean atomic number)α/(Mean atomic number)β = 82/50 = 1.64 i.e. greater than 1
The number of backscattered electrons (BSE) ∝ mean atomic number
(BSE)α/(BSE)β = (Mean atomic number)α/(Mean atomic number)β = 82/50 = 1.64 i.e. greater than 1
2) Smallest or minimum feature size that can be theoretically resolved in an optical Microscope does NOT depend on:
Correct Answer is "B"
Theoretical limit of an optical microscope can be calculated using Abbe’s diffraction limit formula
Abbe’s diffraction limit formula for lateral resolution (i.e. XY),
dl or dx,y = 𝜆/2𝑁𝐴 = 𝜆/2(𝑛𝑠𝑖𝑛𝛼)
Abbe’s diffraction limit formula for axial resolution (i.e Z),
dA or dz = 2𝜆/(𝑁𝐴)2 = 2𝜆/(𝑛𝑠𝑖𝑛𝛼)2
Where,
𝜆 = Wavelength of the radiation
NA = Numerical aperture of the objective lens
n = Refractive index of the medium between the lens and the focal point
α = Half of the angular aperture of the objective lens
Abbe’s diffraction limit formula for lateral resolution (i.e. XY),
dl or dx,y = 𝜆/2𝑁𝐴 = 𝜆/2(𝑛𝑠𝑖𝑛𝛼)
Abbe’s diffraction limit formula for axial resolution (i.e Z),
dA or dz = 2𝜆/(𝑁𝐴)2 = 2𝜆/(𝑛𝑠𝑖𝑛𝛼)2
Where,
𝜆 = Wavelength of the radiation
NA = Numerical aperture of the objective lens
n = Refractive index of the medium between the lens and the focal point
α = Half of the angular aperture of the objective lens
3) Following diagram shows a square 2-D lattice with a hexagonal motif (dark colored). The rotational symmetry element that must be present in the system is:
Correct Answer is "B"
n-fold rotational symmetry of an object means if the object rotates about an axis by an angle of 360°/n then it will repeat itself.
The given figure is a combination of hexagon and square.
Hexagon has six-fold rotational symmetry.
Square has four-fold rotational symmetry.
So the rotational symmetry of the given figure is the G.C.M of hexagon and square’s rotational symmetry.
Hence the given object has two-fold rotational symmetry
The given figure is a combination of hexagon and square.
Hexagon has six-fold rotational symmetry.
Square has four-fold rotational symmetry.
So the rotational symmetry of the given figure is the G.C.M of hexagon and square’s rotational symmetry.
Hence the given object has two-fold rotational symmetry
4) Density of states, D(E), in a three dimensional solid varies with energy (E) as
Correct Answer is "A"
We know that,
Density of states for 1D, D(E)1D ∝ 𝐸-1/2
Density of states for 2D, D(E)2D ∝ 𝐸0
Density of states for 3D, D(E)3D ∝ 𝐸1/2
Density of states for 1D, D(E)1D ∝ 𝐸-1/2
Density of states for 2D, D(E)2D ∝ 𝐸0
Density of states for 3D, D(E)3D ∝ 𝐸1/2
5) The variation of molar volume (Vm) of a liquid showing glass transition temperature (Tg) while cooling from its melting temperature (Tm) is depicted by
Correct Answer is "A"
Variation of molar volume with temperature of a liquid upon cooling are shown below
Curve A is for totally amorphous material (having glass transition temperature)
Curve B is for semi-crystalline material (having glass transition temperature)
Curve C is for crystalline material (no glass transition temperature)
Curve A or Curve B matches only with the figure I of the given problem
6) Find the correct match between polymer name in column I and the monomer type in column II.
COLUMN-I |
COLUMN-II |
I. |
(P) |
II. |
(Q) |
III. |
(R) |
IV. |
(S) |
Correct Answer is "C"
Monomer of the given polymers are shown below
COLUMN-I
COLUMN-II
I. Polyethylene
S.
II. Polypropylene
P.
III. Polyvinylchloride
Q.
IV. Polystyrene
R.
COLUMN-I |
COLUMN-II |
I. |
S. |
II. |
P. |
III. |
Q. |
IV. |
R. |
7) A ceramic has a fracture toughness (KIC) of 1 MPa.m1/2. If this ceramic is to be exposed to a maximum stress (σ) of 200MPa, the maximum value of half crack length ‘a’ (in micrometer, μm), below which the material does not fail, is ______ μm (round off to one decimal place). Loading condition for the sample is shown in the schematic. Assume geometrical factor f=1.2.
Correct Answer is "5.3 – 5.7"
We know that,
KIC = Yσ √(𝝅𝒂)
where,
KIC = Fracture toughness = 1 MPa.m1/2
Y = Geometrical factor = f = 1.2
σ = Maximum stress = 200 MPa
𝒂 = half of the internal crack length = ?
so,
1 = 1.2 × 200 × √(𝝅𝒂)
⇒𝒂 = (𝟏/(𝟏.𝟐 × 𝟐𝟎𝟎))2 × (𝟏/𝝅)
⇒𝒂 = 5.526 × 10-6 m =5.526 nm = 5.5 nm (rounded off to one decimal place)
KIC = Yσ √(𝝅𝒂)
where,
KIC = Fracture toughness = 1 MPa.m1/2
Y = Geometrical factor = f = 1.2
σ = Maximum stress = 200 MPa
𝒂 = half of the internal crack length = ?
so,
1 = 1.2 × 200 × √(𝝅𝒂)
⇒𝒂 = (𝟏/(𝟏.𝟐 × 𝟐𝟎𝟎))2 × (𝟏/𝝅)
⇒𝒂 = 5.526 × 10-6 m =5.526 nm = 5.5 nm (rounded off to one decimal place)
8) A ceramic material is periodically heated and cooled between 25°C and a higher temperature, Tf. During thermal cycling, the material remains dimensionally constrained. The material can withstand a maximum compressive stress of 200 MPa without failure. Material's coefficient of thermal expansion is 7.5 x 10-6 °C-1 and modulus of elasticity (E) is 200 GPa. The lowest value of Tf (in °C) at which material will fail is _______°C (round-off to the nearest integer). Assume that there is no plastic deformation during thermal cycling.
Correct Answer is "157 - 159"
We know that,
σ = Eα Δ𝑻 = Eα (Tf – Ti)
where,
σ = Maximum compressive stress = 200 MPa = 200 × 106 Pa
E = Modulus of elasticity = 200 GPa = 200 × 109 Pa
α = Material’s coefficient of thermal expansion = 7.5 × 10-6 °C-1
Ti = Initial or lowest temperature = 25°C
Tf = Final or highest temperature = ?
So, 200 × 106 = 200 × 109 × 7.5 × 10-6 × (Tf – 25)
⇒Tf = 158.3°C
σ = Eα Δ𝑻 = Eα (Tf – Ti)
where,
σ = Maximum compressive stress = 200 MPa = 200 × 106 Pa
E = Modulus of elasticity = 200 GPa = 200 × 109 Pa
α = Material’s coefficient of thermal expansion = 7.5 × 10-6 °C-1
Ti = Initial or lowest temperature = 25°C
Tf = Final or highest temperature = ?
So, 200 × 106 = 200 × 109 × 7.5 × 10-6 × (Tf – 25)
⇒Tf = 158.3°C
9) During homogeneous solidification of a liquid metal, the radius of critical nucleus (in nanometer, nm) at a temperature Ts which is below the melting point (Tm), is ______ nm (round-off to one decimal place). Given that 𝛾sl (solid liquid interfacial energy) is 0.18 J.m-2 and Δ𝐺v (change in volume free energy upon transformation from liquid to solid) at Ts is 0.18 x109 J.m-3.
Correct Answer is "1.9 – 2.1"
We know that,
r* = - (𝟐𝛾sl)/(Δ𝐺v)
where,
r* = critical radius for stable solid particle during homogeneous nucleation = ?
𝛾sl = solid liquid interfacial energy = 0.18 J.m-2
Δ𝐺v = change in volume free energy = 0.18 × 109 J.m-3
So, r* = - (𝟐 × 𝟎.𝟏𝟖)/(𝟎.𝟏𝟖 × 𝟏𝟎9) = - 2 × 10-9 (negative sign means critical radius decreases as temperature decreases)
⇒│ r*│ = 2 × 10-9 m = 2 nm
r* = - (𝟐𝛾sl)/(Δ𝐺v)
where,
r* = critical radius for stable solid particle during homogeneous nucleation = ?
𝛾sl = solid liquid interfacial energy = 0.18 J.m-2
Δ𝐺v = change in volume free energy = 0.18 × 109 J.m-3
So, r* = - (𝟐 × 𝟎.𝟏𝟖)/(𝟎.𝟏𝟖 × 𝟏𝟎9) = - 2 × 10-9 (negative sign means critical radius decreases as temperature decreases)
⇒│ r*│ = 2 × 10-9 m = 2 nm
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